Pob zeb diamond tab tom tawg mus rau hauv ib qho chaw tshiab hauv kev txawj ntse
Tsis ntev los no, Tuam Tshoj tus CCTV Nyiaj Txiag Xov Xwm tau tshaj tawm tias raws li qhov kev thov rau kev txawj ntse txawj ntse suav lub zog nce ntxiv, pob zeb diamonds -paub tias yog "cov hniav ntawm kev lag luam"- tau nkag mus rau cov ntawv thov tshiab.
Raws li cov khoom hnyav tshaj plaws hauv cov xwm txheej, pob zeb diamond yav dhau los tsuas yog siv rau hauv kev txiav thiab hnav- daim ntaub ntawv tiv taus. Niaj hnub no, vim nws cov thermal conductivity zoo heev, nws tau dhau los ua cov khoom tseem ceeb rau cov cua sov dissipation hauv chips.
Nws cov thermal conductivity yog tsib npaug ntawm tooj liab thiab kaum npaug ntawm silicon, uas tuaj yeem ua tau raws li qhov xav tau ntawm cov cua kub ntau ntxiv ntawm cov servers loj.
Core Advantage: Thaum tshav kub kub Dissipation Performance
1. Muaj peev xwm ua kom muaj cua sov muaj zog: Lub thermal conductivity yog kwv yees li 2000-2200 W / (m·K), uas yog 5 npaug ntawm tooj liab thiab 10 npaug ntawm silicon. Nws tuaj yeem tawg sai sai cov cua sov tsim los ntawm cov nti.
2. Kev ua haujlwm ruaj khov: Qhov siab tshaj plaws hardness, zoo heev rwb thaiv tsev, thiab thermal expansion coefficient tsawg ua rau nws haum rau 3nm - qib precision chips, txo thermal stress thiab to leakage risk.
3. Daim ntawv thov tseem ceeb: Thaum ib qho -chip fais fab noj ntau tshaj 1400W, pob zeb diamond txias dhau los ua cov tshuaj uas nyiam.
Kev Txhim Kho Kev Lag Luam: Los ntawm Chav Ua Haujlwm mus rau Industrialization
1. Kev thov Surge: Tus naj npawb ntawm cov pob zeb diamond cua sov xa tuaj rau kev kuaj xyuas hauv 2025 yog tsib npaug ntawm xyoo 2024, thiab los ntawm thawj plaub lub hlis ntawm 2026, nws tau dhau tag nrho xyoo 2025.
2. Kev Txhim Kho Txuj Ci: Lub Ib Hlis 2026, ib qho kev sim tshiab tau tso tawm, ua kom cov qauv kev lag luam nrawm nrawm dua.
3. Scope Expansion: Nws tau txuas ntxiv los ntawm nti txias mus rau siab -kawg teb xws li kev sib txuas lus hauv paus chaw nres tsheb, radars, thiab cov khoom siv hluav taws xob hauv aerospace.
4. Suav Qhov Zoo: Cov khoom tsim tawm ntawm cov pob zeb hluavtaws muaj ntau dua 90% ntawm lub ntiaj teb tag nrho. Cov saw hlau ua lag luam tau nrawm nrawm rau nws cov txheej txheem, thiab kev tsim khoom muaj peev xwm thiab thev naus laus zis tau ua kom nrawm nrawm.
Nqi Bottlenecks thiab Solutions
1. Pure Pob Zeb Diamond: Kev ua tau zoo tshaj plaws tab sis tus nqi siab heev, txwv tsis pub loj - daim ntawv thov.
2. Pob zeb diamond - Copper Composite Material (Mainstream Solution):
3.Thermal Conductivity: Kwv yees li 550-950 W / (m·K) (ib nrab ntawm cov pob zeb diamond ntshiab).
4. Tus nqi: Tsuas yog 1/5 - 1/10 ntawm pob zeb diamond ntshiab.
5. Kev nce qib: Cia siab tias yuav yog huab hwm coj- tsim tawm xyoo 2026, dhau los ua lub zog tseem ceeb hauv nruab nrab - cov xwm txheej suav.
Kev Ua Lag Luam Zej Zog: Kev ua kom nrawm nrawm ntawm trillion-Kev lag luam duas
1.Short-lub sij hawm (2025-2026): Lub lag luam loj ntawm pob zeb diamond txias cov kev daws teeb meem yog kwv yees li 1 billion yuan, nrog AI servers thiab high-end chips ua lub hauv paus tsav tsheb.
2. Ntev- lub sij hawm: maj mam nkag mus rau cov khoom siv hluav taws xob thiab cov khoom siv hluav taws xob hauv tsheb, nrog rau lub ntiaj teb kev lag luam loj yuav tsum tshaj 15 billion US dollars los ntawm 2030.
3. Tus nqi ua haujlwm: Pob zeb diamond txav los ntawm kev ua "cov khoom zoo meej hauv kev sim" mus rau "cov khoom siv tseem ceeb hauv kev lag luam", thiab yuav 深度融合 nrog cov khoom siv semiconductor yav tom ntej
